Kerf Industries is your source for precision wire saw slicing and wafering of rare materials.
Our precision diamond wire saw can be used to cut extremely thin slices of virtually any material with minimal loss.
This technology is commonly used in the solar and semiconductor industry where rigorous standards are needed to achieve extremely accurate wafers of conductive materials. This same precision can be adapted for other industries as well. We can even cut geological samples such as meteorites, fossils, and gemstones.
The sky is the limit!
Please contact us for your slicing and wafering needs.